Discover the Future of Mechanical, Chemical, and Material Engineering

13th World Congress on Mechanical, Chemical, and Material Engineering (MCM 2027)

HTFF 2027
ICMIE 2027
MMME 2027
ICCPE 2027
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The 13th World Congress on Mechanical, Chemical, and Material Engineering (MCM 2027) will be delivered in-person in Prague, Czech Republic and virtually, providing the opportunity of online presentation for the people who cannot travel for any reason. Attendees will be able to connect with researchers from across the globe and network in-person or virtually. The registration fee for virtual participation is reduced.

MCM is celebrating its 13th anniversary, marking over a decade of advancing the field of Mechanical, Chemical, and Materials Engineering through collaborative research and cutting-edge presentations.

MCM is aimed to become one of the leading international annual congresses in the field of Mechanical, Chemical, and Materials Engineering. The congress is composed of 4 conferences. While each conference consists of an individual and separate theme, the 4 conferences share considerable overlap, which prompted the organization of this congress.

HTFF 2027, 14th International Conference on Heat Transfer and Fluid Flow
ICMIE 2027, 16th International Conference on Mechanics and Industrial Engineering
MMME 2027, 14th International Conference on Mining, Material, and Metallurgical Engineering
ICCPE 2027, 13th International Conference on Chemical and Polymer Engineering

This congress will provide excellent opportunities to the scientists, researchers, industrial engineers, and university students to present their research achievements and to develop new collaborations and partnerships with experts in the field.

Submissions in the form of extended abstracts, short papers, and full manuscripts are welcome.

  • all submitted papers will be peer-reviewed
  • the Mechanical, Chemical, and Material Engineering congress proceedings will be published under an ISSN and ISBN number
  • the congress proceedings will be indexed by ScopusGoogle Scholar and Semantic Scholar
  • each paper will be assigned a unique DOI number by Crossref
  • the proceedings will be permanently archived in Portico (one of the largest community-supported digital archives in the world).
  • selected papers from the congress can be submitted for possible publication in one of the following journals (publication fees may apply)

Authors presenting via poster boards should be informed that the poster board dimensions are 90 cm in height and 70 cm in width.

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Important Dates

Submission Deadline

January 21, 2027

Notification to Authors

February 25, 2027

Early-Bird Registration

March 18, 2027

Qiu

Dr. Huihe Qiu

The Hong Kong University of
Science & Technology, Hong Kong

Congress Chair

Iasiello

Dr. Marcello Iasiello

Università degli Studi di Napoli Federico II, Italy

Congress Co-Chair

Papers must be prepared in English and carefully reviewed for grammatical accuracy. To ensure high scientific quality, all figures should be presented clearly and in high resolution. For more information, please visit the Author Guidelines page.

Submissions Portal

Submissions in the form of extended abstracts, short papers, and full manuscripts are welcome. To submit your paper to MCM 2027 or one of the associated MCM sub-conferences of the World Congress on Mechanical, Chemical, and Material Engineering , please use the submission links below:

The MCM 2027 offers discounted early bird registration. Register early to save!

Important Dates

The important dates and deadlines for the 13th World Congress on Mechanical, Chemical, and Material Engineering (MCM 2027) are as follows:

Venue

MCM 2027 will be held in Prague, Czech Republic. Prague is one of the most popular tourist destinations, known for its many attractions.

Sponsors

There are currently three types of sponsorships available for MCM 2027. All sponsors will be provided with an exhibition table at the conference.

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IJEPR
Unina

The previous event in this congress series, MCM 2026, was held on 18 – 20 August, 2026 in London, United Kingdom. Our year-long planning and collaboration with several committees resulted in a highly successful event featuring keynote presentations, technical sessions, and networking opportunities. Below is a short highlight video from the conference.

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